NXP i.MX 8M Mini TalkTogether

NXP i.MX 8M Mini TalkTogether reference design brings distortion-free voice calling to the high performing NXP i.MX 8M Mini processor to enable full duplex voice communication on IP conference speaker phones, smart speakers, sound bars etc. DSP Concepts’ ACM qualified front-end eliminates echo with low latency to provide natural voice experience in the transmit as well as the receive direction.

Extend the TalkTogether design to meet Microsoft Teams or Zoom certification with multi-mic TalkTogether configurations including fixed or adaptive Beamformer, Direction of Arrival (DoA) and advanced noise reduction for seamless audio conferencing.


  • High quality, full duplex voice communication 
    • Robust to double talk, acoustic echo and distortion issues
    • 50+ dB echo cancellation together with AEC and Residual echo suppressor
  • Flexible tuning options
    • 1-mic TalkTogether with advanced tuning options to trade-off between echo cancellation and speech quality
  • Reduce tuning and certification risks and costs
    • Optimized production ready algorithms

Audio Front-end Features

  • DSP Concepts’ TalkTogether for natural, distortion-free voice calls
    • Acoustic Echo Canceller together with Echo Residual Suppression for full duplex voice quality
    • Single Channel Noise Reduction (SCNR) to eliminate stationary noises such as fan noise, HVAC, etc.
    • Tx Automatic Gain Control (AGC) for optimal hearing in the far-end
    • Rx Equalization and volume control for improved speech quality in the near-end.

Software Integrations

  • Audio Weaver Designer: Drag-and-drop graphical tool to customize and tune audio processing models in real-time with 500+ modules
  • Audio Weaver Core: Embedded audio-processing engine for Cortex-A53
  • TalkTogether audio front-end for full duplex voice calls
  • Customizable speaker processing

Hardware Specifications

  • Processor
    • i.MX 8M Mini Quad core application processor
    • 4x Arm® Cortex®-A53 Core @ 1.8 GHz
    • 1x Arm® Cortex®-M4 @ 400 MHz
  • Memory
    • 32-bit LPDDR4 w/2 GB
    • eMMC 5.0/5.1 w/16 GB
    • SD/MMC connector
    • QSPI w/32 MB
  • Audio I/O
    • Audio DAC 24-bit 192 kHz stereo
    • HP Jack 3.5 mm audio connector
    • Board expansion connector for audio interfaces
  • Connectivity
    • 10/100/1000 Ethernet
    • USB 3.0 Type C connector
    • PCIe M.2 interface

Included with the demo kit:

  • NXP i.MX 8M Mini Evaluation kit with i.MX 8M Mini Quad applications processor
  • DSP Concepts 6-mic Circular array board
  • Microphone interposer board
  • Micro SIP VOIP client for windows PC
  • USB connectors

Ready to get started?

Schedule time to speak with one of our audio experts.