IC Partners

The Audio Weaver development platform is available to deploy and optimized for the most popular chipsets from leading semiconductor companies

Audio Weaver Embedded
Bluetooth Speakers
TWS, Smart Speakers
Smart Speakers
Automotive
Consumer electronics, data center, automotive, IoT
TV, IoT
Automotive, Home Audio, Voice Conferencing, Soundbars, Smart Speakers
Automotive, Home Audio, Smart Speakers, Soundbars
Automotive, Smart Appliances
Automotive
Smart Speakers

Processor and Core Support

  • DSPs, MCUs and Application Processors

  • Standard + Advanced Module Optimization

  • Voice Module Optimization

  • ARM Cortex-M4, -M7, -M33

  • ARM Cortex-A

  • Cadence HiFi 2 and HiFi3 (Fixed-point only)

    N/A
  • Cadence HiFi 4

  • ADI SHARC, ADI SHARC+ UL XP

  • TI C66x

  • CEVA X2

  • Qualcomm Hexagon (V66)

  • X86 Windows and Linux

  • Cadence Tensilica HiFi 5

  • ARM Cortex-M55 (Helium)

    Q3 2022 Q3 2022
  • RISC-V

    Roadmap Roadmap
  • DSPs, MCUs and Application Processors

  • Standard + Advanced Module Optimization

  • Voice Module Optimization

  • ARM Cortex-M4, -M7, -M33

    • DSPs, MCUs and Application Processors

    • Standard + Advanced Module Optimization

    • Voice Module Optimization

  • ARM Cortex-A

    • DSPs, MCUs and Application Processors

    • Standard + Advanced Module Optimization

    • Voice Module Optimization

  • Cadence HiFi 2 and HiFi3 (Fixed-point only)

    • DSPs, MCUs and Application Processors

    • Standard + Advanced Module Optimization

    • Voice Module Optimization

      N/A

  • Cadence HiFi 4

    • DSPs, MCUs and Application Processors

    • Standard + Advanced Module Optimization

    • Voice Module Optimization

  • ADI SHARC, ADI SHARC+ UL XP

    • DSPs, MCUs and Application Processors

    • Standard + Advanced Module Optimization

    • Voice Module Optimization

  • TI C66x

    • DSPs, MCUs and Application Processors

    • Standard + Advanced Module Optimization

    • Voice Module Optimization

  • CEVA X2

    • DSPs, MCUs and Application Processors

    • Standard + Advanced Module Optimization

    • Voice Module Optimization

  • Qualcomm Hexagon (V66)

    • DSPs, MCUs and Application Processors

    • Standard + Advanced Module Optimization

    • Voice Module Optimization

  • X86 Windows and Linux

    • DSPs, MCUs and Application Processors

    • Standard + Advanced Module Optimization

    • Voice Module Optimization

  • Cadence Tensilica HiFi 5

    • DSPs, MCUs and Application Processors

    • Standard + Advanced Module Optimization

    • Voice Module Optimization

  • ARM Cortex-M55 (Helium)

    • DSPs, MCUs and Application Processors

    • Standard + Advanced Module Optimization

      Q3 2022

    • Voice Module Optimization

      Q3 2022

  • RISC-V

    • DSPs, MCUs and Application Processors

    • Standard + Advanced Module Optimization

      Roadmap

    • Voice Module Optimization

      Roadmap

Ready to get started?